1 05190.r8 2/07 www.protekdevices.com emif6-100fc emi filter/tvs array 05190 applications ? cellular phones ? notebooks ? personal digital assistant (pda) ? ground positioning system (gps) ? smart card iec compatibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns features ? esd protection > 25 kilovolts ? bidirectional emi filtering/tvs low pass filters ? low insertion loss: -3db roll-off @ 60mhz ? protects up to six(6) data lines ? rohs compliant mechanical characteristics ? 15 bump flip chip package ? weight 0.73 milligrams (approximate) ? available in lead-free plating ? solder reflow temperature: lead-free - sn/ag/cu, 96/3.5/0.5: 260-270c ? consult factory for leaded device availability ? flammability rating ul 94v-0 ? 8mm tape and reel per eia standard 481 pin configuration 15 bump flip chip
for each line
2 05190.r8 2/07 www.protekdevices.com emif6-100fc device characteristics storage temperature symbol v alue 100 mw c -55 to 150 units t stg p parameter dc power per resistor operating temperature t a -40 to 85 c maximum ratings @ 25c unless otherwise specified typical resistance @ 20% r 100 ohms note 1: 20% tolerance. part number minimum breakdown voltage @ 1ma v (br) volts maximum reverse leakage current @3.3v i d a typical forward voltage @10ma v f volts typical capacitance per line (see note 1) @2.5v, 1mhz c line pf emif6-100fc 6.0 0.5 0.8 54 minimum attenuation @ 800-3000 mhz db 30 rated stand-off voltage v wm volts 5.0 electrical characteristics per line @ 25c unless otherwise specified 60 cut-off frequency (50 ohms i/o) zero bias fc mhz figure 1 resistance vs temperature (normalized to resistance at 25c) temperature c 0.900 normalized resistance 1.100 1.060 1.020 0.940 0.980 -40 -20 0 20 40 60 80 100
3 05190.r8 2/07 www.protekdevices.com emif6-100fc graphs figure 4 overshoot & clamping voltage esd test pulse: -15 kilovolt, 1/30ns (waveform) 1 volts per division -4 -2 0 2 4 figure 3 overshoot & clamping voltage esd test pulse: +15 kilovolt, 1/30ns (waveform) 5 volts per division -5 5 15 25 35 figure 2 insertion loss gain (db) frequency (mhz) 0 volts 2.5 volts
4 05190.r8 2/07 www.protekdevices.com emif6-100fc solder recommendations ramp-up ramp-down ramp-up 15 seconds solder time 15-20 seconds ramp-down t s - preheat t smax t smin t l t 25c to peak 30-60 seconds temperature - c t p 155 140 0.275mm round non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening (laser cut, 5% tapered walls) solder paste type pad protective finish tolerance - edge to corner ball solder ball side coplanarity maximum dwell time above liquidous (183c) soldering maximum temperature printed circuit board recommendations parameter value requirements temperature: t p for lead-free (snagcu): 260-270c t p for tin-lead: 240-245c preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. recommended non-solder mask defined pad illustration non-solder mask defined pad 0.275mm dia. solder mask opening 0.325mm dia. solder stencil opening 0.330mm dia.
5 05190.r8 2/07 www.protekdevices.com emif6-100fc 15 bump flip chip package outline & dimensions copyright ? prot ek devices 2007 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility wit h respect to the selection or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com outline & dimensions: rev 2 - 8/06, 06042
!"#$%&'( a b c d e f g h i j 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 0.1148 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.0170 0.0130 dim millimeters inches package dimensions package outline 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 0.1183 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.0220 0.0180 min min max max note: 1. controlling dimensions in millimeters. ') *#$+,'# - +
.+)/#( %&%!,+.*# !#$, )# ,'#0 1(#$
.$#)+. 2##" tape & reel specifications (dimensions in millimeters) de p0 t fp2 w 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 p 4.00 0.10 0.200.025 a0 b0 k0 reel dia. tape width 178mm (7?) 8mm 1.78 0.05 3.35 0.05 0.76 0.05 3 4 ( !"#$&,(5"#2. #"'," && !"#$&,(5 '# . 6 && !"#$(+# ).! '# . 6 && solder pad layout tape & reel ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia-481. 2. plastic 8mm tape: suffix-t73-1 = 7 inch reel - 3,000 pieces per reel, i.e., emif6-100fc-t73-1. 3. suffix - lf = lead-free, i.e., emif6-100fc-lf-t73-1. 4. suffix - c = coated version, i.e., emif6-100fc-t73c-1.
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